FP1505 Series Flat-Pac™ High Current High Frequency Power Inductors - 伊顿EATON BUSSMANN产品资料中心

Description

• Halogen Free

• 125°C maximum total operating temperature

• 7.0 x 15.0 x 5.0mm surface mount package

• Ferrite core material

• High current handling capability, low core loss

• Designed for high speed, high current switch mode applications

• Controlled DCR tolerance for sensing circuits

• Inductance range from 100nH to 400nH

• Current range from 24 to 105 amps

• Frequency range up to 1MHz

• RoHS compliant

Applications

• Multi-phase regulators

• Voltage Regulator Module (VRM)

• Desktop and server VRMs and EVRDs

• Data networking and storage systems

• Notebook regulators

• Graphics cards and battery power systems

• Point of load modules

• DCR current sensing

Environmental Data

• Storage temperature range: -40°C to +125°C

• Operating temperature range: -40°C to +125°C (with derated current)

• Solder reflow temperature: J-STD-020D compliant Packaging

• Supplied in tape-and-reel packaging, 744 parts per reel, 13” diameter reel

Product Specifications

Part Number7	OCL1 ± 10% (nH)	FLL2 Min. (nH)	Irms3 (Amps)	Isat14 (Amps) @25°C	Isat25 (Amps) @125°C	DCR (mΩ) @20°C	K-factor6
FP1505R1-R10-R	100	72	53	105	90	0.47 ± 7%	356.3
FP1505R1-R12-R	120	86		87	75		356.3
FP1505R1-R15-R	150	108		72	60		356.3
FP1505R1-R25-R	250	180		42	32		356.3
FP1505R1-R30-R	300	217		35	26		356.3
FP1505R1-R40-R	400	288		24	19.5		356.3

1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc

2 Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms, Isat1

3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application.

4 Isat1: Peak current for approximately 20% rolloff at +25°C.

5 Isat2: Peak current for approximately 20% rolloff at +125°C.

6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH),ΔI (Peak-to-peak ripple current in amps).

7 Part Number Definition: FP1505Rx-Rxx-R

• FP1505 = Product code and size

• Rx= DCR indicator

• Rxx= Inductance value in uH, R = decimal point

• -R suffix = RoHS compliant

Dimensions - mm

Packaging Information - mm

Temperature Rise vs.Total Loss

Core Loss

Inductance Characteristics

Solder Reflow Profile

Table 1 - Standard SnPb Solder (Tc)

Package Thickness	Volume mm3
Package Thickness	<350	>_350
<2.5mm	235°C	220°C
>_2.5mm	220°C	220°C

Table 2 - Lead (Pb) Free Solder (Tc)

Package Thickness	Volume mm3
Package Thickness	<350	350 - 2000	>2000
<1.6mm	260°C	260°C	260°C
1.6 – 2.5m	m 260°C	250°C	245°C
>2.5mm	250°C	245°C	245°C

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsmin)	100°C	150°C
	• Temperature max. (Tsmax)	150°C	200°C
	• Time (Tsmin to Tsmax) (ts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3°C/ Second Max.	3°C/ Second Max.
Liquidous temperature (TL) Time at liquidous (tL)		183°C 60-150 Seconds	217°C 60-150 Seconds
Peak package body temperature (TP)*		Table 1	Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)		20 Seconds**	30 Seconds**
Average ramp-down rate (Tp to Tsmax)		6°C/ Second Max.	6°C/ Second Max.
Time 25°C to Peak Temperature		6 Minutes Max.	8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.