Description
The Cooper Bussmann® PolySurg™ 42510ESDA four-channel array ESD suppressor protects sensitive electronic circuits from the threat of electrostatic discharge (ESD) without distorting data signals. This protection is a result of its ultra-low capacitance (0.1pF typical) that is well suited for HDMI ESD protection applications.
Features
• Halogen free, lead free and RoHS compliant for global applications
• Ultra-low capacitance (0.1pF typical) ideally suited for protecting high speed data applications
• Provides ESD protection with fast response time (<1ns) allowing equipment to pass the IEC 61000-4-2 Level 4 test
• Four (4) channel array
• Zero signal distortion
• Low leakage current (<0.01µA typical)
Applications
Applied to a high speed signal interface, the 42510ESDA protects:
• Digital video equipment
• Mobile phone
• GPS Antenna
• Bluetooth communication equipment antenna circuit
• IEEE-1394
• DVI
• HDMI
Part Numbering System:
Packaging
• Supplied in tape and reel packaging, 5000 parts per seven inch (178mm) reel per EIA Standard 481-1
Ordering Information
| Catalog Number | Description |
| 42510ESDA-TR1 |
5000 suppressors in paper tape on a 7 inch (178mm) reel |
Electrical Specifications
| Characteristic | Value/Range |
| Rated Voltage (max) | 12V |
| Leakage Current (max @ 12Vdc) | 0.01μA |
| Trigger Voltage (Vt) | 300V Typical |
| Clamping Voltage (Vc) | 30V Typical |
| Capacitance (Cp) @1MHz* | 0.1pF Typical |
| Response Time | <1ns |
|
ESD Voltage Capability, IEC 61000-4-2 Contact Discharge Mode |
8kV |
|
ESD Voltage Capability, IEC 61000-4-2 Air Discharge Mode |
15kV |
| ESD Withstand Pulses | 100 Times Minimal |
Environmental Specifications
| Characteristic | Value |
| Load Humidity | +85°C/90%RH with rated voltage for 1000 hrs |
| Thermal Shock | -40°C to +85°C, 30 minute cycle, 5 cycles |
| Moisture Resistance Test |
J-STD-020 Standard: Level 2 (1 year floor life under 30°C/65%RH conditions |
| Operating Temperature Range | -40°C to +85°C (-40°F to 185°F) |
| Storage Temperature Range | -55°C to +125°C (-67°F to +257°F) |
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Hand soldering - soldering tip should not directly touch part - 280°C max for 3 sec. max
• Peak reflow temperatures and durations:
- IR Reflow = 260°C max for 20 sec. max
- Wave Solder = 260°C max for 10 sec. max
Recommended IR Reflow Profile
Design Considerations
• Follow the soldering recommendations to avoid deforming product
• Do not use high temperature, high humidity or corrosive atmospheres(sulfide and chloride gas) that could damage the solderability
• Moisture Sensitivity Level (MSL) according to J-STD-020 standard: Level 2 (Floor Life 1 year under <30°C/65%RH conditions)
• Solderability requirement according to IPC/JEDEC J-STD-002C, Test D, Test B1
• Use Sn/Ag/Cu (96.5/3.0/0.5) or equivalent solder and activated flux #5 or equivalent.
Circuit Schematic
HDMI Application
Dimensions - mm
Recommended Pad Layout - mm
Tape and Reel Packaging Specifications - mm
Circuit Schematic
HDMI Application
Dimensions - mm
Recommended Pad Layout - mm
Tape and Reel Packaging Specifications - mm
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