Description
Cooper Bussmann TVSA Series of transient voltage suppressors are designed to protect electronic circuits from ESD damage. With its small, standardized 0201 and 0402 sizes, it’s easy to implement them into any circuit board design.
Features
• Lead free, halogen free and RoHS compliant for global applications
• Single-line, bi-directional device for placement flexibility
• Silicon based chip
• Low capacitance to meet the needs for high speed single transient voltage protection
• Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 level 4 test
• Low profile designs for board space savings
• Low leakage current reduces power consumption
• Low clamping voltage
• Solid-state silicon-avalanche technology
Applications
• Computers and peripherals
• Digital still cameras
• Cell phones
• PDAs
• DVD Players
• MP3/Multimedia players
• A-V Equipment
• External storage
• DSL Modems
• Set top boxes
• Docking systems
Part Numbering System:
Packaging
• Size 0201: 15,000 pieces per reel - EIA (EIAJ)
• Size 0402: 10,000 pieces per reel - EIA (EIAJ)
Specifications
Specifications
|
Part Number |
Size |
Stand-Off Voltage |
Breakdown Voltage |
Clamping Voltage At Ipeak = 1A |
Capacitance pF | ESD Air/Contact (kV) |
Leakage Current (typical) |
| TVSA02V05C004 | 0201 | 5 | 10 | 17 | 4 | 15/8 | < 10nA |
| TVSA04V05C006 | 0402 | 5 | 10 | 17 | 6 | 15/8 | < 10nA |
Stand-off Voltage - Maximum DC operating voltage the diode can maintain and not exceed 1mA leakage current.
Breakdown Voltage - Measured at any I/O pin to ground at 1mA DC current.
Clamping Voltage - Maximum peak voltage across the diode with 8/20ms waveform and 1A pulse current.
Capacitance - Device capacitance measured with zero volt bias at 1MHz.
ESD Air/Contact - Voltages tested to IEC 61000-4-2.
Environmental Specifications
Environmental Specifications
| Characteristic | Value |
| Bias Humidity: | +40°C, 90% RH for 1000 hrs |
| Thermal Shock: | -40°C to +85°C, 30 min cycle, 5 cycles |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temp Range: | -40°C to +85°C |
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:
- IR Reflow = 260°C max for 30 sec. max.
- Wave Solder = 260°C max. for 10 sec. max.
• Recommended IR Reflow Profile:
Dimensions - mm
Recommended Pad Layout - mm (in)
Tape Packaging Specifications - mm
Dimensions - mm
Recommended Pad Layout - mm (in)
Tape Packaging Specifications - mm
总机: 0755-82862885, 82862629
传真: 总机 转 801
邮箱: service@bussmann.net.cn
网址: http://www.bussmann.net.cn
资料中心: http://www.bm-bussmann.com