FP0705 Series Flat-Pac™ High Current Low-Profile Power Inductors - 伊顿EATON BUSSMANN产品资料中心

Description

• 125°C maximum total temperature operation

• 7.0 x 7.0 x 4.95mm surface mount package

• Ferrite core material, High current carrying capacity

• Low core losses

• Controlled DCR tolerance for sensing circuits

• Inductance range from 72nH to 220nH

• Current range from 20 to 65 Amps, frequency range up to 2MHz

• RoHS compliant

Applications

• Portable electronics

• Servers and workstations

• Data networking and storage systems

• Notebook and desktop computers

• Graphics cards and battery power systems

• Multi-phase regulators

• Voltage Regulator Module (VRM)

• DCR sensing

Environmental Data

• Storage temperature range: -40°C to +125°C

• Operating temperature range: -40°C to +125°C (Range is application specific)

• Solder reflow temperature: J-STD-020D compliant

Packaging

• Supplied in tape-and-reel packaging, 950 parts per reel,13” dia. reel

Product Specifications

Part Number	OCL1 ± 10% (nH)	FLL2 Min. (nH)	Irms3 (Amps)	Isat14 @ 25°C (Amps)	Isat25 @ 125°C (Amps)	DCR (mOhm)@20°C	K-factor6
R1 Version
FP0705R1-R07-R	72	51	43	65	50	0.25 ± 10%	826
FP0705R1-R10-R	105	75		44	36		826
FP0705R1-R12-R	120	86		37	30		826
FP0705R1-R15-R	150	108		30	24		826
FP0705R1-R18-R	180	130		25	20		826
FP0705R1-R22-R	220	158		20	16		826
R2 Version
FP0705R2-R07-R	72	51	38	65	50	0.32 ± 9.4%	826
FP0705R2-R10-R	105	75		44	36		826
FP0705R2-R12-R	120	86		37	30		826
FP0705R2-R15-R	150	108		30	24		826
FP0705R2-R18-R	180	130		25	20		826
FP0705R2-R22-R	220	158		20	16		826
R3 Version
FP0705R3-R07-R	72	51	32	65	50	0.46 ± 6.5%	826
FP0705R3-R10-R	105	75		44	36		826
FP0705R3-R12-R	120	86		37	30		826
FP0705R3-R15-R	150	108		30	24		826
FP0705R3-R18-R	180	130		25	20		826
FP0705R3-R22-R	220	158		20	16		826

1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc

2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1

3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application.

4 Isat1: Peak current for approximately 20% rolloff at +25°C.

5 Isat2: Peak current for approximately 20% rolloff at +125°C.

6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss), K: (K-factor from table), L: (inductance in nH),ΔI (peak-to-peak ripple current in amps).

7 Part Number Definition: FP0705Rx-Rxx-R

• FP0705 = Product code and size
• Rx is the DCR indicator

• Rxx= Inductance value in μH, R = decimal point
• “-R” suffix = RoHS compliant

Dimensions - mm A = 7.0 Max. B = 7.0 Max. C = 4.95 Max. D = 2.45 ± 0.2 E = 1.52 ± 0.2 F = 3.5 Typ.

Packaging Information - mm

Supplied in tape-and-reel packaging, 950 parts per reel, 13” diameter reel

Temperature Rise vs. Total Loss

Inductance Characteristics

Core Loss

Solder Reflow Profile

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsmin)	100°C	150°C
	• Temperature max. (Tsmax)	150°C	200°C
	• Time (Tsmin to Tsmax) (ts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3°C/ Second Max.	3°C/ Second Max.
Liquidous temperature (TL) Time at liquidous (tL)		183°C 60-150 Seconds	217°C 60-150 Seconds
Peak package body temperature (TP)*		Table 1	Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)		20 Seconds**	30 Seconds**
Average ramp-down rate (Tp to Tsmax)		6°C/ Second Max.	6°C/ Second Max.
Time 25°C to Peak Temperature		6 Minutes Max.	8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum