FP0805 Series Flat-Pac™ High Current High Frequency Low-Profile Power Inductors - 伊顿EATON BUSSMANN产品资料中心

Description

• Halogen free

• 125°C maximum total temperature operation

• 7.5 x 7.6 x 5mm surface mount package

• Ferrite core material

• High current carrying capacity, Low core losses

• Controlled DCR tolerance for sensing circuits

• Inductance range from 32nH to 200nH

• Current range from 20 to 110 Amps

• Frequency range up to 2MHz

• RoHS compliant

Applications

• Multi-phase regulators

• Voltage Regulator Module (VRM)

• Point-of-load modules

• Desktop and server VRM’s and EVRD’s

• Data networking and storage systems

• Notebook regulators

• Graphics cards and battery power systems

• DCR sensing

Environmental Data

• Storage temperature range: -40°C to +125°C

• Operating temperature range: -40°C to +125°C (Range is application specific)

• Solder reflow temperature: J-STD-020D compliant

Packaging

• Supplied in tape and reel packaging, 950 parts per reel,13 inch diameter reel.

Product Specifications

Part Number7	OCL1 ± 10% (nH)	FLL2 Min. (nH)	Irms3 (Amps)	Isat14 @ 25°C (Amps)	Isat25 @ 125°C (Amps)	DCR (mΩ) @ 20°C	K-factor6
FP0805R1-R03-R	32	23	65	110	95	0.17 ± 17%	823.6
FP0805R1-R06-R	58	42		83	61		823.6
FP0805R1-R07-R	72	52		67	49		823.6
FP0805R1-R10-R	100	72		50	35		823.6
FP0805R1-R20-R	200	144		20	16		823.6

1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc

2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1

3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application.

4 Isat1: Peak current for approximately 20% rolloff at +25°C.

5 Isat2: Peak current for approximately 20% rolloff at +125°C.

6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss),K: (K-factor from table), L: (inductance in nH),ΔI (peak-to-peak ripple current in amps).

7 Part Number Definition: FP0805Rx-Rxx-R

• FP0805 = Product code and size
• Rx is the DCR indicator

• Rxx= Inductance value in μH, R = decimal point
• “-R” suffix = RoHS compliant

Dimensions - mm

Packaging Information - mm

Temperature Rise vs.Total Loss

Core Loss

Inductance Characteristics

Solder Reflow Profile

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsmin)	100°C	150°C
	• Temperature max. (Tsmax)	150°C	200°C
	• Time (Tsmin to Tsmax) (ts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3°C/ Second Max.	3°C/ Second Max.
Liquidous temperature (TL) Time at liquidous (tL)		183°C 60-150 Seconds	217°C 60-150 Seconds
Peak package body temperature (TP)*		Table 1	Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)		20 Seconds**	30 Seconds**
Average ramp-down rate (Tp to Tsmax)		6°C/ Second Max.	6°C/ Second Max.
Time 25°C to Peak Temperature		6 Minutes Max.	8 Minutes Max.