
Description
• Halogen free
• 125°C maximum total temperature operation
• 7.5 x 7.6 x 5mm surface mount package
• Ferrite core material
• High current carrying capacity, Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 32nH to 200nH
• Current range from 20 to 110 Amps
• Frequency range up to 2MHz
• RoHS compliant
Applications
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Point-of-load modules
• Desktop and server VRM’s and EVRD’s
• Data networking and storage systems
• Notebook regulators
• Graphics cards and battery power systems
• DCR sensing
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C (Range is application specific)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 950 parts per reel,13 inch diameter reel.
Product Specifications
Product Specifications
Part Number7 | OCL1 ± 10% (nH) | FLL2 Min. (nH) | Irms3 (Amps) | Isat14 @ 25°C (Amps) | Isat25 @ 125°C (Amps) | DCR (mΩ) @ 20°C | K-factor6 |
FP0805R1-R03-R | 32 | 23 | 65 | 110 | 95 | 0.17 ± 17% | 823.6 |
FP0805R1-R06-R | 58 | 42 | 83 | 61 | 823.6 | ||
FP0805R1-R07-R | 72 | 52 | 67 | 49 | 823.6 | ||
FP0805R1-R10-R | 100 | 72 | 50 | 35 | 823.6 | ||
FP0805R1-R20-R | 200 | 144 | 20 | 16 | 823.6 |
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application.
4 Isat1: Peak current for approximately 20% rolloff at +25°C.
5 Isat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss),K: (K-factor from table), L: (inductance in nH),ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP0805Rx-Rxx-R
• FP0805 = Product code and size
• Rx is the DCR indicator
• Rx is the DCR indicator
• Rxx= Inductance value in μH, R = decimal point
• “-R” suffix = RoHS compliant
Dimensions - mm

Packaging Information - mm

Temperature Rise vs.Total Loss

Core Loss

Inductance Characteristics

Solder Reflow Profile

Reference JDEC J-STD-020D
• “-R” suffix = RoHS compliant
Dimensions - mm

Packaging Information - mm

Temperature Rise vs.Total Loss

Core Loss

Inductance Characteristics

Solder Reflow Profile

Reference JDEC J-STD-020D
Profile Feature | Standard SnPb Solder | Lead (Pb) Free Solder | |
Preheat and Soak | • Temperature min. (Tsmin) | 100°C | 150°C |
• Temperature max. (Tsmax) | 150°C | 200°C | |
• Time (Tsmin to Tsmax) (ts) | 60-120 Seconds | 60-120 Seconds | |
Average ramp up rate Tsmax to Tp | 3°C/ Second Max. | 3°C/ Second Max. | |
Liquidous temperature (TL) Time at liquidous (tL) |
183°C 60-150 Seconds |
217°C 60-150 Seconds |
|
Peak package body temperature (TP)* | Table 1 | Table 2 | |
Time (tp)** within 5 °C of the specified classification temperature (Tc) | 20 Seconds** | 30 Seconds** | |
Average ramp-down rate (Tp to Tsmax) | 6°C/ Second Max. | 6°C/ Second Max. | |
Time 25°C to Peak Temperature | 6 Minutes Max. | 8 Minutes Max. |
总机: 0755-82862885, 82862629
传真: 总机 转 801
邮箱: service@bussmann.net.cn
网址: http://www.bussmann.net.cn
资料中心: http://www.bm-bussmann.com