FP1008 Series High Frequency High Current Power Inductors - EATON BUSSMANN(巴斯曼)资料中心

Product description:

• Halogen free, lead free, RoHS compliant

• 125°C maximum total temperature operation

• 10.8 x 8.0 x 8.0mm maximum surface mount package

• Ferrite core material

• Controlled DCR for sensing circuits

• Inductance range from 114nH to 180nH

• Current range from 63 to 106 Amps

Applications:

• Multi-phase regulators

• Voltage Regulator Modules (VRMs)

• Desktop and server VRMs and EVRDs

• Notebook regulators

• Data networking and storage systems

• Graphics cards and battery power systems

• Point-of-Load modules

• DCR Sensing circuits

Environmental data:

•Storage temperature range (Component): -40°C to +125°C

•Operating temperature range: -40°C to +125°C

•(ambient + self-temperature rise)

•Solder reflow temperature: J-STD-020D compliant

Packaging:

• Supplied in tape and reel packaging, 350 parts per 13” diameter reel

Product specifications

Part Number 9	OCL 1 (nH).10%	Fll min. 2 (nH)	Irms.3 (amps)	Isat 1 4 (Amps)	Isat 2 5 (Amps)	Isat 3 6 (Amps)	lsat 4 7 (Amps)	DCR (mΩ) @20°C	K-factor 8
FP1008-120-R	114	82		106	100.7	97	88	0.17±5%	366
FP1008-150-R	144	104	63	82	78	75	68		366
FP1008-180-R	180	130		64	60.8	58.6	53		366

1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc @ 25°C

2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1

3. Irms: DC current for an approximate temperature rise of 30°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application.

4. Isat1: Peak current for approximately 20% rolloff @ 25°C

5. Isat2: Peak current for approximately 20% rolloff @ 85°C

6. Isat3: Peak current for approximately 20% rolloff @ 100°C

7. Isat4: Peak current for approximately 20% rolloff @ 125°C

8. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps).

9. Part Number Definition: FP1008-xxx-R

- FP1008= Product code and size

- xxx= Inductance value in nH

- “-R” suffix = RoHS compliant

Dimensions - mm

DCR measured from point “A” to point “B”

Part marking: FP1008-xxx xxx = Inductance value in nH

wwllyy= date code, R= revision level

Tolerances are +/- 0.205 millimeters unless stated otherwise.

All soldering surfaces to be be coplanar within 0.1 millimeters.

Packaging information - mm

Supplied in tape-and-reel packaging, 350 parts on a 13” diameter reel

Core loss

Inductance characteristics

Solder reflow profile

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsminl	100 °C	150 °C
	• Temperature max. (Tsmax)	150 °C	200 °C
	• Time (Tsmin to Tsmax) tts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3 °C/ Second Max.	3 °C/ Second Max.
Liquidous temperatureσL) Time at liquidous (tL)		183 °C 60-150 Seconds	217 °C 60-150 Seconds
Peak package body temperatureσp)		Table 1	Table 2
Time (tp) within 5 °C of the specified classification temperatureσc)		20 Seconds	30 Seconds
Average ramp-down rateσP to Tsmax)		6 °C/ Second Max.	6 °C/ Second Max.
Time 25 °C to Peak Temperature		6 Minutes Max.	8 Minutes Max.