FP1005 Series Flat-Pac™ High Current High Frequency Low-Profile Power Inductors - 伊顿EATON BUSSMANN产品资料中心

Description

• Halogen free

• 125°C maximum total temperature operation

• 10.2 x 7.0 x 4.95mm surface mount package

• Ferrite core material

• High current carrying capacity, Low core losses

• Controlled DCR tolerance for sensing circuits

• Inductance range from 85nH to 220nH

• Current range from 33 to 90 amps

• Frequency range up to 2MHz

• RoHS compliant

Applications

• Multi-phase regulators

• Voltage Regulator Module (VRM)

• Point-of-load modules

• Desktop and server VRMs and EVRDs

• Data networking and storage systems

• Notebook regulators

• Graphics cards and battery power systems

• DCR sensing

Environmental Data

• Storage temperature range: -40°C to +125°C

• Operating temperature range: -40°C to +125°C (Range is application specific)

• Solder reflow temperature: J-STD-020D compliant

Packaging

• Supplied in tape and reel packaging, 950 parts per reel, 13” dia. reel

Product Specifications

Part Number7	OCL1 ± 10% (nH)	FLL2 Min. (nH)	Irms3 (Amps)	Isat14 @ 25°C (Amps)	Isat25 @ 125°C (Amps)	DCR (mΩ) @ 20°C	K-factor6
R1 Version
FP1005R1-R08-R	85	61	53	90	64	0.39 ± 7.7%	536
FP1005R1-R10-R	100	72		73	57		536
FP1005R1-R12-R	120	86		60	48		536
FP1005R1-R15-R	150	108		47	37		536
FP1005R1-R22-R	220	158		33	26		536
R2 Version
FP1005R2-R08-R	85	61	50	90	64	0.47 ± 6.7%	536
FP1005R2-R10-R	100	72		73	57		536
FP1005R2-R12-R	120	86		60	48		536
FP1005R2-R15-R	150	108		47	37		536
FP1005R2-R22-R	220	158		33	26		536
R3 Version
FP1005R3-R08-R	85	61	45	90	64	0.55 ± 5.4%	536
FP1005R3-R10-R	100	72		73	57		536
FP1005R3-R12-R	120	86		60	48		536
FP1005R3-R15-R	150	108		47	37		536
FP1005R3-R22-R	220	158		33	26		536

1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc

2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1

3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat-generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application.

4 Isat1: Peak current for approximately 20% rolloff at +25°C.

5 Isat2: Peak current for approximately 20% rolloff at +125°C.

6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss), K: (K-factor from table), L: (inductance in nH),ΔI (peak-to-peak ripple current in amps).

7 Part Number Definition: FP1005Rx-Rxx-R

• FP1005 = Product code and size
• Rx is the DCR indicator

• Rxx= Inductance value in μH, R = decimal point
• “-R” suffix = RoHS compliant

Dimensions - mm

Packaging Information - mm

Temperature Rise vs.Total Loss

Core Loss

Inductance Characteristics

Solder Reflow Profile

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsmin)	100°C	150°C
	• Temperature max. (Tsmax)	150°C	200°C
	• Time (Tsmin to Tsmax) (ts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3°C/ Second Max.	3°C/ Second Max.
Liquidous temperature (TL) Time at liquidous (tL)		183°C 60-150 Seconds	217°C 60-150 Seconds
Peak package body temperature (TP)*		Table 1	Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)		20 Seconds**	30 Seconds**
Average ramp-down rate (Tp to Tsmax)		6°C/ Second Max.	6°C/ Second Max.
Time 25°C to Peak Temperature		6 Minutes Max.	8 Minutes Max.