Flat-Pac™ FP0404 Series High Current High Frequency Power Inductors - 伊顿EATON BUSSMANN产品资料中心

Description

• High current carrying capacity

• Low core loss

• Frequency range up to 2MHz

• Inductance Range from 22nH to 110nH

• Current range from 14 amps to 40 amps

• 4.0x4.0mm footprint surface mount package in 3.0 and 4.0mm heights

• Ferrite core material

• Halogen free, lead free, RoHS compliant

Applications

• Multi-phase and Vcore regulators

• Voltage Regulator Modules (VRMs)

• Server and desktop VRMs and EVRDs

• Laptop and notebook regulators

• Data networking and storage systems

• Graphics cards and battery power systems

• Point-of-Load modules

Environmental Data

• Storage temperature range (component): -40°C to +125°C

• Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise)

• Solder reflow temperature: J-STD-020D compliant

Product Specifications

Part Number5	OCL1 (nH) ±15%	FLL2 (nH) minimum	Irms 3 (amps)	Isat14 (amps)	Isat25 (amps)	Isat36 (amps)	DCR (mΩ) @ 20°C ±25%	K-factor7
FP0404R1-R022-R	22 ±20%	15	19	40	34	32	0.32 ± 15%	2351
FP0404R1-R065-R	65	44	19	24	22	20	0.32	2248
FP0404R1-R080-R	80	54	19	20	18	16	0.32	2248
FP0404R1-R100-R	100	68	19	16	14	13	0.32	2248
FP0404R1-R110-R	110	74	19	14	13	12	0.32	2248

1. Open Circuit Inductance (OCL) Test Parameters: 100kHz (1MHz for R022), 0.1Vrms, 0.0Adc, 25°C

2. Full Load Inductance (FLL) Test Parameters: 100kHz (1MHz for R022), 0.1Vrms, Isat1, 25°C

3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents.

PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C underworst case operating conditions verified in the end application.

4. Isat1 : Peak current for approximately 20% rolloff @ +25°C

5. Isat2 : Peak current for approximately 20% rolloff @ +100°C

6. Isat3 : Peak current for approximately 20% rolloff @ +125°C

7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak to peak ripple current in Amps).

8. Part Number Definition: FP0404-Rxxx-R

FP0404 = Product code and size

Rx= DCR indicator

Rxxx=Inductance value in μH, R=decimal point

-R suffix = RoHS compliant

Dimensions (mm)

Packaging information (mm)

FP0404R1-R022-R

Supplied in tape and reel packaging, 1,800 parts per 13” diameter reel

Packaging information (mm)

FP0404R1-R065-R, R080-R, R100-R, R110-R

Supplied in tape and reel packaging, 1,800 parts per 13” diameter reel

Temperature rise vs. total loss

Core loss

FP0404R1-R022-R

FP0404R1-R065-R, R080-R, R100-R, R110-R

Inductance characteristics

Solder reflow profile

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsmin)	100°C	150°C
	• Temperature max. (Tsmax)	150°C	200°C
	• Time (Tsmin to Tsmax) (ts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3°C/ Second Max.	3°C/ Second Max.
Liquidous temperature (Tl) Time at liquidous (tL)		183°C 60-150 Seconds	217°C 60-150 Seconds
Peak package body temperature (TP)*		Table 1	Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)		20 Seconds**	30 Seconds**
Average ramp-down rate (Tp to Tsmax)		6°C/ Second Max.	6°C/ Second Max.
Time 25°C to Peak Temperature		6 Minutes Max.	8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.