FP1208 Series High Frequency High Current Power Inductors - 伊顿EATON BUSSMANN产品资料中心

Description

• Halogen free, lead free, RoHS compliant

• 125°C maximum total temperature operation

• 12.1x8.0x8.0mm maximum surface mount package

• Ferrite core material

• Controlled DCR for sensing circuits

• Inductance range from 150nH to 250nH

• Current range from 44 to 85 Amps

Applications

• Multi-phase regulators

• Voltage Regulator Modules (VRMs)

• Desktop and server VRMs and EVRDs

• Notebook regulators

• Data networking and storage systems

• Graphics cards and battery power systems

• Point-of-Load modules

•DCR Sensing circuits

Environmental Data

• Storage temperature range (Component): -40°C to +125°C

• Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)

• Solder reflow temperature: J-STD-020D compliant

Packaging

• Supplied in tape-and reel packaging, 5 00 parts per 13” diameter reel

Product Specifications

Part Number	OCL1 (nH)±10%	FLL min.2 (nH)	Irms3 (Amps)	Isat14 (Amps)	Isat25 (Amps)	Isat36 (Amps)	DCR (mΩ) @ 20°C	K-factor7
FP1208R1-R15-R	150	114	50	85	79	72	0.29±5%	283
FP1208R1-R18-R	180	137		72	66	63		283
FP1208R1-R21-R	210	160		65	57	55		283
FP1208R1-R23-R	230	176		61	53	50		283
FP1208R1-R25-R	250	191		55	48	44		283

1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc@25°C

2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1

3. Irms: DC current for an approximate temperature rise of 40°C without core loss.

Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application.

4. Isat1: Peak current for approximately 20% rolloff @ 25°C

5. Isat2: Peak current for approximately 20% rolloff @ 85°C

6. Isat3: Peak current for approximately 20% rolloff @ 125°C

7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak to peak ripple current in Amps).

8. Part Number Definition: FP1208Rx-Rxx-R:

- FP1208= Product code and size

- Rx= DCR indicator

- Rxx= Inductance value in µH

- “-R” suffix = RoHS compliant

Dimensions - mm

Packaging Information - mm

Supplied in tape and reel packaging, 500 parts on a 13” diameter reel

Temperature Rise vs. Total Loss

Core Loss

Inductance Characteristics

Solder Reflow Profile

Reference JDEC J-STD-020D

Profile Feature		Standard SnPb Solder	Lead (Pb) Free Solder
Preheat and Soak	• Temperature min. (Tsmin)	100°C	150°C
	• Temperature max. (Tsmax)	150°C	200°C
	• Time (Tsmin to Tsmax) (ts)	60-120 Seconds	60-120 Seconds
Average ramp up rate Tsmax to Tp		3°C/ Second Max.	3°C/ Second Max.
Liquidous temperature (TL) Time at liquidous (tL)		183°C 60-150 Seconds	217°C 60-150 Seconds
Peak package body temperature (TP)*		Table 1	Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)		20 Seconds**	30 Seconds**
Average ramp-down rate (Tp to Tsmax)		6°C/ Second Max.	6°C/ Second Max.
Time 25°C to Peak Temperature		6 Minutes Max.	8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.