cooper bussmann

FP1208 Series High Frequency High Current Power Inductors


• Halogen free, lead free, RoHS compliant
• 125°C maximum total temperature operation
• 12.1x8.0x8.0mm maximum surface mount package
• Ferrite core material
• Controlled DCR for sensing circuits
• Inductance range from 150nH to 250nH
• Current range from 44 to 85 Amps

• Multi-phase regulators
• Voltage Regulator Modules (VRMs)
• Desktop and server VRMs and EVRDs
• Notebook regulators
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-Load modules
•DCR Sensing circuits
Environmental Data
• Storage temperature range (Component): -40°C to +125°C
• Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant
• Supplied in tape-and reel packaging, 5 00 parts per 13” diameter reel

Product Specifications
Part Number OCL1
FLL min.2
DCR (mΩ) @ 20°C K-factor7
FP1208R1-R15-R 150 114 50 85 79 72 0.29±5% 283
FP1208R1-R18-R 180 137 72 66 63 283
FP1208R1-R21-R 210 160 65 57 55 283
FP1208R1-R23-R 230 176 61 53 50 283
FP1208R1-R25-R 250 191 55 48 44 283
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc@25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3. Irms: DC current for an approximate temperature rise of 40°C without core loss.
Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application.
4. Isat1: Peak current for approximately 20% rolloff @ 25°C
5. Isat2: Peak current for approximately 20% rolloff @ 85°C
6. Isat3: Peak current for approximately 20% rolloff @ 125°C
7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak to peak ripple current in Amps).
8. Part Number Definition: FP1208Rx-Rxx-R:
- FP1208= Product code and size
- Rx= DCR indicator
- Rxx= Inductance value in µH
- “-R” suffix = RoHS compliant

Dimensions - mm

Packaging Information - mm

Supplied in tape and reel packaging, 500 parts on a 13” diameter reel
Temperature Rise vs. Total Loss

Core Loss

Inductance Characteristics

Solder Reflow Profile

Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (TL)
Time at liquidous (tL)
60-150 Seconds
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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